A team from the University of Macau (UM) State Key Laboratory of Analog and Mixed-Signal VLSI and Institute of Microelectronics (IME) recently presented its research findings at the 71th International Solid-State Circuits Conference (ISSCC) of the Institute of Electrical and Electronics Engineers (IEEE) held in San Francisco, United States. 14 papers from UM were accepted at this year’s conference, number of publications tied with Samsung and Korea Advanced Institute of Science and Technology (KAIST) for the top spot in the world. These achievements reflect the international recognition of UM and its leading position in the field.
873 papers were accepted at this year’s conference, out of a total of 234 paper submissions from around the world. UM contributed 14 papers as the primary affiliation as well as 2 co-authored papers. In line with the theme of this year’s conference ‘ICs for a Better World’, the papers submitted by UM cover topics such as data conversion, wireless communications, power conversion, and voice-signal processing, which are all associated with emerging research areas, including Internet of Things, artificial intelligence, and big data. Their contents present innovative ideas for circuits in bulk-CMOS technologies. Members of the UM team who attended this year’s conference include Law Man-Kay, Lu Yan, Yin Jun, Chan Chi-Hang, Huang Mo, Lei Ka-Meng, Jiang Yang, and a number of UM researchers and postgraduate students.
Tingxu Hu, a PhD student, received the Pre-doctoral Achievement Award from the IEEE Solid-State Circuits Society in recognition of his outstanding research achievements in microelectronics. In addition, 1 PhD student of microelectronics from UM were invited to give presentation in the Student Research Previews section.
Organised by the IEEE Solid-State Circuits Society, the ISSCC is the most prestigious international conference in the field of electronics, with a rigorous paper selection process. It is also the world’s largest and highest-level conference on solid-state circuits held annually, which showcases the latest global trends in solid-state circuit research and development. The UM team’s trip to this year’s event was sponsored by the Science and Development Fund of Macao and the university.
