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Conference papers and presentations

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Category: Conference papers and presentations Total: 532
Guangshu Zhao, Chao Xie, Chenxi Wang, Yang Jiang, Milin Zhang, Pui-In Mak, Rui P. Martins and Man-Kay Law, A 63ns Flipping Time, 93.6% Voltage Flipping Efficiency Auto-Calibrated Ultrasonic Energy Harvesting Interface from −25 to 85°C

IEEE Custom Integrated Circuits Conference (CICC)

 Apr-2024
Pengyu He, Yuanzhe Zhao, Heng Xie, Yang Wang, Shouyi Yin, Li Li, Yan Zhu, R. P. Martins, Chi-Hang Chan and Minglei Zhang, A 28nm 314.6TLFOPS/W Reconfigurable Floating-Point Analog Compute-In-Memory Macro with Exponent Approximation and Two-Stage Sharing TD-ADC

IEEE Custom Integrated Circuits Conference (CICC)

 Apr-2024
Shuhao Fan, Qi Zhou, Ka-Meng Lei, Pui-In Mak and Rui P. Martins, A Miniature Multi-Nuclei NMR/MRI Platform with a High-Voltage SOI ASIC Achieving a 134.4dB Image SNR with a 173×250×103μm3 Resolution

IEEE Int. Solid-State Circuits Conf. (ISSCC) 2024

 pp. 316-317 Feb-2024
Rui Luo, Ka-Meng Lei, Rui P. Martins and Pui-In Mak, A 0.5V 6.14μW Trimming-Free Single-XO Dual-Output Frequency Reference with [5.1nJ, 120μs] XO Startup and [8.1nJ, 200μs] Successive-Approximation-Based RTC Calibration

IEEE International Solid-State Circuits Conference (ISSCC)

 Feb-2024
Haijun Shao, Rui P. Martins and Pui-In Mak, A 167μW 71.7dB-SFDR 2.4GHz BLE Receiver Using a Passive Quadrature-Front-End, a Double-Sided Double-Balanced Cascaded Mixer and a Dual-Transformer-Coupled Class-D VCO

2024 IEEE International Solid-State Circuits Conference (ISSCC)

 pp. 406-408 Feb-2024
Chaorui Zou, Yaozhong Ou, Yan Zhu, R. P. Martins, Chi-Hang Chan and Minglei Zhang, A 256×192 Pixel 30fps Automotive Direct Time-of-Flight LiDAR using 8× Current-Integrating-based TIA, Hybrid Pulse Position/Width Converter, and Intensity/CNN-Guided 3D Inpainting

IEEE International Solid-State Circuits Conference (ISSCC)

 Feb-2024
Fei Tan, Wei-Han Yu, Jinhai Lin, Ka-Fai Un, Rui P. Martins and Pui-In Mak, A 1.8% FAR, 2ms Decision Latency, 1.73nJ/Decision Keywords Spotting (KWS) Chip Incorporating Transfer-Computing Speaker Verification, Hybrid-Domain Computing and Scalable 5T-SRAM

IEEE International Solid-State Circuits Conference (ISSCC)

 Feb-2024
Tingxu Hu, Mo Huang, Rui Paulo Martins and Yan Lu, A 750mW, 37% Peak Efficiency Isolated DC-DC Converter with 54/18Mb/s Full-Duplex Communication Using a Single Pair of Transformers

IEEE International Solid-State Circuits Conference (ISSCC)

 Feb-2024
Yuefeng Cao, Minglei Zhang, Yan Zhu, R. P. Martins and Chi-Hang Chan, A 12GS/s 12b 4× Time-Interleaved Pipelined ADC with Comprehensive Calibration of TI Errors and Linearized Input Buffer

IEEE International Solid-State Circuits Conference (ISSCC)

 Feb-2024
Yuanfei Wang, Mo Huang, Rui Paulo Martins and Yan Lu, A SIDO/DISO VCF-Step-Reconfigurable Continuously Scalable-Conversion-Ratio SC Converter Achieving 91.4%/92.6% Peak Efficiency and Almost-lossless Channel Switching

IEEE International Solid-State Circuits Conference (ISSCC)

 Feb-2024
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