The Distinguished Lecture on “Design of Supply Modulators for RF Power Amplifier Systems” will take place as follows:
Date: 17 November 2022 (Thursday)
Time: 14:30 – 16:00
Venue: To be held online via Zoom (https://umac.zoom.us/j/98502724643?pwd=bEUyV0FJdFJqQlQ1N3hmdnB6MGN6QT09)
The speaker is:
Prof. LIU Xun, Assistant Professor, The School of Science and Engineering (SSE), Chinese University of Hong Kong, Shenzhen, China
The Lecture is:
Design of Supply Modulators for RF Power Amplifier Systems
Radio-frequency (RF) power amplifiers (PA) are top power consuming components, especially with today’s 5G technology. To improve the PA’s efficiency, dynamic power supply technologies, such as average power tracking (APT) and envelope tracking (ET) have been proposed. High-frequency 3-level switching converters are proposed for the APT application due to the advantages of high efficiency, small ripple and fast tracking speed. An envelope-shaping-and-tracking CMOS PA system was proposed for LTE application. In the system, an AC-coupling supply modulator of a 3-level switching amplifier assisted by a wide-bandwidth linear amplifier is designed. The supply modulator achieves high efficiency and the CMOS PA system is well qualified for LTE standards with much lower costs.
Dr. Xun Liu is an Assistant Professor with the School of Science and Engineering (SSE), Chinese University of Hong Kong, Shenzhen. Her research interests include power management integrated circuits design, radio-frequency power amplifier system design, hybrid switching converters design, etc. Dr. Liu received the B.Eng. degree in Electronic and Information Engineering from Zhejiang University, China in 2011, and the Ph.D. degree in electronic and computer engineering from The Hong Kong University of Science and Technology (HKUST), Hong Kong, in 2017. She was a senior design engineer with Qualcomm, Santa Clara, CA, USA, working on cutting-edge integrated circuits and systems designs for 5G application and holding 2 US patents. Dr. Liu has been invited to serve as a technical program committee (TPC) member at International Solid-State Circuit Conference (ISSCC) since 2021.
For more details, kindly find the event poster, abstract and bio.