The Distinguished Lecture on “High-Efficiency Single-Stage Wireless Power Receiver and Wireless Charger” will take place as follows:
Date: 16 December 2021 (Thursday)
Venue: To be held online via Voov Meeting: 238-614-695 (https://meeting.tencent.com/dm/Plnwo6vRjac4)
The speaker is:
Prof. CHENG Lin (程林教授), Professor, School of Microelectronics, University of Science and Technology
The Lecture is:
High-Efficiency Single-Stage Wireless Power Receiver and Wireless Charger
Power delivering with galvanic isolation is essential to guarantee system safety and reliability in harsh industry environments. However, efﬁciently transferring power of hundreds of mW across an isolation barrier with low electromagnetic emission is challenging for such size- and cost-constrained applications. In this talk, two highly efficient isolated dc-dc converters will be presented. In the first design, a transformer-in-package isolated DC-DC converter using glass-based fan-out wafer-level packaging (FOWLP) is proposed. By using FOWLP, the transformer and the interconnections are both formed by 3 redistribution layers to reduce the form factor and cost and to improve the power density. The transmitter and the receiver were embedded in a compact 5mm×5mm package, and the proposed converter achieves 46.5% peak efficiency and 1.25W maximum output power. In the second design, an isolated DC-DC converter with a cross-coupled shoot-through-free Class-D oscillator is proposed. The proposed Class-D oscillator greatly improves the EMI performance with high efficiency and low cost. Consequently, the converter achieves 51% peak efficiency and 1.2W maximum output power, and meets the CISPR-32 Class B standard on a two-layer PCB without using any stitching capacitor.
Prof. Cheng Lin received the B. Eng degree from Hefei University of Technology, Hefei, China, in 2008, the M. Sc. degree from Fudan University, Shanghai, China, in 2011, and the Ph.D. degree from The Hong Kong University of Science and Technology (HKUST), Kowloon, Hong Kong, in 2016, respectively. In 2018, he joined the School of Microelectronics, University of Science and Technology, where he is currently a Professor. He was a Postdoctoral Research Associate with the Department of Electronic and Computer Engineering, HKUST, from 2016 to 2018, and was an Intern Analog Design Engineer with Broadcom Limited, San Jose, USA, from 2015 to 2016. His current research interests include power management and mixed-signal integrated circuits and systems.
Prof. Cheng was the recipient of the IEEE Solid-State Circuits Society Pre-doctoral Achievement Award (2014–2015), Hong Kong Institution of Science 2018 Young Scientist Awards (Honorable Mention) and Best Design Award of 2020 IEEE ASP-DAC University Design Contest.
For more details, kindly find the event poster, abstract and bio.