The Distinguished Lecture on “Smart Vision Chip” will take place as follows:
Date: 31 May 2023 (Wednesday)
Time: 14:30 – 16:00
Venue: To be held online via Zoom (https://umac.zoom.us/j/95183098053?pwd=M3ljbFV6Ums4a1hiRDZIMS9Sa1lzUT09)
The speaker is:
Prof. LIU Liyuan, Professor, Institute of Semiconductors, Chinese Academy of Sciences, China
The Lecture is:
Smart Vision Chip
Abstract:
Vision chip is a tight couple of image sensor, processor which shows advantage in in-situ image intelligent processing for the aim of low latency and low power consumption. Key techniques in vision chip design include implementation of CMOS compatible vision sensor, high-efficiency on-chip processor and integration of sensor and processor monolithically. This talk firstly gives a historic overview of vision chip. Then we talk about several image sensor architecture and design techniques suitable for low latency imaging. After that, we discuss about hardware and software co-optimization for high parallel and low power image processor design. Several vision design examples are shown at last. The talk ends with a perspective for future vision chip development.
Biography:
Prof. LIU Liyuan received the B.S. and Ph.D. degrees in electrical engineering from Electronic Engineering Department, Institute of Microelectronics, Tsinghua University, Beijing, China, in 2005 and 2010, respectively. In 2012, he joined the State Key Laboratory of Superlattices and Microstructures, Institute of Semiconductors, Chinese Academy of Sciences, Beijing, as an Associate Professor, where he became a Professor in 2018. His current research interests are high speed CMOS image sensors, SPAD based 3-D image sensors, CMOS terahertz image sensors, smart processors for edge computing and design of monolithic vision chip. Prof. Liu is a member of IEEE. He serves as vice chair of IEEE SSCS Beijing Chapter. He was a TPC Member for the IEEE Asian Solid-State Circuits Conference (A-SSCC) from 2013 to 2018. He was TPC chair for IEEE International Conference on Integrated Circuits Technologies and Applications (ICTA) from 2019 to 2020. He is an Associate Editor of Journal of Semiconductors. He is a member of Youth Innovation Promotion Association, CAS and committee member of Beijing Institute of Electronics (BIE).
For more details, kindly find the event poster, abstract and bio.
