Academic Qualifications
• Ph.D. in Electrical and Electronics Engineering, Department of Electronic and Computer Engineering, Hong Kong University of Science and Technology, Hong Kong, China (2014)
• B.Eng. in Electronic Science and Technology, College of Information Science and Electronic Engineering, Zhejiang University, China (2008)
Professional Experience
Experience in Academia
• Associate Professor, Institute of Microelectronics, University of Macau (Dec. 2025 – Present)
• Associate Professor, Dept. of ECpE, Iowa State University, Ames, IA, US (Jul. 2025 – Dec. 2025)
• Harpole-Pentair Assistant Professor, Dept. of ECpE, Iowa State University, Ames, IA, US (Aug. 2023 – Jul. 2025)
• Assistant Professor, Dept. of ECpE, Iowa State University, Ames, IA, US (Jan. 2018 – Jul. 2025)
• Project Researcher, Keio University, Yokohama, Kanagawa, Japan, (Oct. 2014 – Jan. 2016)
Experience in Industry
• Staff Scientist, Broadcom Limited, San Jose, CA, US (Feb. 2016 – Dec. 2017)
Research
Research Interests
• Power Management Integrated Circuits
Awards
• IEEE Solid-State Circuits Society Outstanding Reviewer Award, 2024
• NSF CAREER Award, 2024
• Harpole-Pentair Young Faculty Award, Aug. 2023
Professional Services
• TPC member for IEEE International Solid-State Circuits Conference (ISSCC)
• TPC member and the Power Management Sub-committee Chair for IEEE Custom Integrated Circuits Conference (CICC)
• TPC member of the Analog Signal Processing Sub-Committee (ASP) of the IEEE Circuits and Systems (CAS) Society
• TPC member for the International Workshop on Power Supply on Chip (PwrSoC), 2025
• Guest Editor for IEEE Transactions on Circuits and Systems – I: Regular Papers, 2025
• Associate Editor for Journal of Semiconductors, 2024 – Now.
• Associate Editor for IEEE Transactions on Circuits and Systems – II: Express Brief, 2020 – 2023
• Guest Editor for IEEE Solid-State Circuits Letters, Special Issue for CICC, 2023
• Student Participation Grant Chair of IEEE Midwest Symposium on Circuits and Systems (MWSCAS) 2024.
• Track Chair for the IEEE Midwest Symposium on Circuits and Systems (MWSCAS) 2021.
Other Publications
1. Z. Li, J. Tang, N. Singh, J. Jiang, W. Zhu, X. Sun, L. Dong and C. Huang, “A Single-Power-Link 13.56MHz Wireless Power and Data Transfer System with Synchronized Phase-Shifted Time-Multiplexing Dual Uplinks for Implantable Voltammetry”, accepted in IEEE International Solid-State Circuits Conference (ISSCC), Feb. 2026.
2. W. Zhu, J. Jiang, X. Sun, Z. Li, T. Gu, X. Zhang and C. Huang, “A Single-Chip Laser Diode Driver with Built-In Frequency-Sweep Linearization for FMCW LiDAR”, accepted in IEEE International Solid-State Circuits Conference (ISSCC), Feb. 2026.
3. X. Li, W. Peng, L. Kumar, X. Zhao, C. Huang and S. Du, “A Battery-Powered Hybrid Resonant Pulse-Train Generator with Adaptive Frequency Tracking and Residual Energy Recycling for Ultrasonic Implants”, accepted in IEEE International Solid-State Circuits Conference (ISSCC), Feb. 2026.
4. J. Jiang, L. Zhao, J. Tang and C. Huang, “SLiMDO: A Single-Link Multi-Domain-Output Isolated DC-DC Converter with Passive Magnetic Flux Sharing for Local Energy Distribution and Rx Behaviour Sensing-Based Global Power Modulation”, IEEE Journal of Solid-State Circuits (JSSC) 2025, Early Access.
5. J. Jiang, L. Zhao, J. Tang and C. Huang, “A Single-Link Multi-Domain-Output (SLiMDO) Isolated DC-DC Converter with Passive Magnetic Flux Sharing for Local Energy Distribution and Rx Behaviour Sensing-Based Global Power Modulation”, accepted in IEEE International Solid-State Circuits Conference (ISSCC), Feb. 2025.
6. L. Zhao, J. Tang, X. Zhang, K. Wei, R. Magod and C. Huang, “A 96.1% Efficiency Single-Inductor Multiple-Output (SIMO) Buck Converter with 2.1A/ns Transient Speed and 2.2A Maximum Current Capacity”, IEEE Journal of Solid-State Circuits (JSSC) 2024, Early Access.
7. J. Tang, L. Zhao and C. Huang, “A Through-Power-Link Hysteretic Controlled Capacitive Isolated DC-DC Converter with Enhanced Efficiency and Common-Mode Transient Immunity”, IEEE Journal of Solid-State Circuits (JSSC) 2024, Early Access.
8. J. Jiang, J. Tang, L. Zhao, C. Zhan and C. Huang, “A 63% Efficiency 1.29-W Single-Link Multiple-Output (SLiMO) Isolated DC-DC Converter Using FPC Micro-Transformer with Local Voltage and Global Power Regulations”, IEEE Journal of Solid-State Circuits (JSSC) 2023, Early Access.
9. Y. Tan, C. Huang and H. Ishikuro, “Design of Dual Lower-Bound Hysteresis Control in Switched-Capacitor DC-DC Converter for Optimum Efficiency and Transient Speed in Wide Loading Range for IoT Application”, IEEE Journal of Solid-State Circuits (JSSC) 2023, Early Access.
10. G. Liu, H. Wu, C. Hu, C. Huang, X. Liu and J. Jiang, “An 85-264Vac to 3-4.2Vdc 1.05W Capacitive Power Converter with Idle Power Reduction and 4-Phase 1/10X SC Converter Achieving 5.11mW Quiescent Power and 78.2% Peak Efficiency”, in IEEE International Solid-State Circuits Conference (ISSCC) 2024.
11. L. Zhao, J. Tang, K. Wei and C. Huang, “A 4-Phase DAB Current-Mode Hysteretic Controlled Buck Converter With Relaxed Inductor Requirements and Enhanced DC and Dynamic Performance”, IEEE Journal of Solid-State Circuits (JSSC) 2023, Early Access.
12. J. Tang, L. Zhao and C. Huang, “A Wireless Hysteretic Controlled Wireless Power Transfer System with Enhanced Efficiency and Dynamic Response for Bioimplants”, IEEE Journal of Solid-State Circuits (JSSC), vol. 58, no. 4, pp. 1160-1171, Apr. 2023.
13. J. Tang, L. Zhao and C. Huang, “A 68.5% Efficiency Reconfigurable 400-/800-mW Capacitive Isolated DC-DC Converter with Common-Mode Transient Immunity and Fast Dynamic Response by Through-Power-Link Hysteretic Control”, in IEEE International Solid-State Circuits Conference (ISSCC), Feb. 2022.
14. J. Tang, L. Zhao and C. Huang, “A Wireless Power Transfer System with Up-to-20% Light-Load Efficiency Enhancement and Instant Dynamic Response by Fully Integrated Wireless Hysteretic Control for Bioimplants”, in IEEE International Solid-State Circuits Conference (ISSCC) 2021, pp. 470-472, Feb. 2021.
15. C. Huang, T. Kawajiri and H. Ishikuro, “A 13.56-MHz Wireless Power Transfer System with Enhanced Load-Transient Response and Efficiency by Fully-Integrated Wireless Constant-Idle-Time Control for Biomedical Implants”, IEEE Journal of Solid-State Circuits (JSSC), vol 53, no.2, pp. 538-551, Feb. 2018.
16. X. Liu, C. Huang and P. K. T. Mok, “A High-Frequency Three-Level Buck Converter With Real-Time Calibration and Wide Output Range for Fast-DVS”, IEEE Journal of Solid-State Circuits (JSSC), vol 53, no. 2, pp. 582-595, Feb. 2018.
17. C. Huang, T. Kawajiri and H. Ishikuro, “A Near-Optimum 13.56 MHz CMOS Active Rectifier with Circuit-Delay Real-Time Calibrations for High-Current Biomedical Implants”, IEEE Journal of Solid-State Circuits (JSSC), vol 51, no. 8, pp. 1797-1809, Aug. 2016.
18. C. Huang and P. K. T. Mok, “A 100 MHz 82.4% Efficiency Package-Bondwire Based Four-Phase Fully-Integrated Buck Converter with Flying Capacitor for Area Reduction”, IEEE Journal of Solid-State Circuits (JSSC), vol 48, no. 12, pp. 2977-2988, Dec. 2013.
19. C. Huang and P. K. T. Mok, “An 84.7% Efficiency 100-MHz Package Bondwire-Based Fully Integrated Buck Converter With Precise DCM Operation and Enhanced Light-Load Efficiency”, IEEE Journal of Solid-State Circuits (JSSC), vol 48, no. 11, pp. 2595-2607, Nov. 2013.
20. C. Huang and P. K. T. Mok, “An 82.4% Efficiency Package Bondwire Based Four-Phase Fully-Integrated Buck Converter with Flying Capacitor for Area Reduction”, in IEEE International Solid-State Circuits Conference (ISSCC), pp. 362-363, San Francisco, Feb. 2013.
21. J. Jiang, Y. Lu, C. Huang, W.-H. Ki and P. K. T. Mok, “A 2-/3-Phase Fully Integrated Switched-Capacitor DC-DC Converter in Bulk-CMOS for Energy-Efficient Digital Circuits With 14% Efficiency Improvement”, in IEEE International Solid-State Circuits Conference (ISSCC), pp. 366-367, San Francisco, Feb. 2015.